Hylo®Bond M511

INSTRUCTIONS FOR USE

The surface to be bonded can have a great impact on the cured properties of Hylobond. Care must be taken to ensure that all traces of oil, grease and dirt are removed from the substrate. This can be done with a degreasing agent or solvent such as acetone. Abrading or etching the surface can greatly improve the adhesion of the bonded joint, if this is done a second degreasing process is highly recommended.

Prior to dispensing it is important to extrude a bead of about 5cm in length. This is to ensure that both components are being extruded at the same rate. The product should be used immediately to prevent curing in the nozzle. Enough adhesive should be used to fill the bond gap before the parts are joined. Once the substrates are joined sufficient pressure should be applied (e.g. by clamping) to avoid dry bonding and prevent movement in the joint. These processes must be completed before the geltime expires.

The optimal application temperature is about 20°C, the geltime and cure time will be affected at temperatures much higher or lower than this. The viscosity is also affected by temperature so to ensure a consistent extrusion rate and geltime the temperature should be kept constant.

Typical Physical Properties